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在AI算力需求指数级增长的驱动下,数据中心互连的带宽与功耗瓶颈日益凸显。光电共封装(CPO)技术,通过将光引擎与计算芯片在封装层面深度融合,被普遍视为突破这一瓶颈、重构下一代算力基础设施的决定性路径。我们正站在产业从“技术突破”迈向“量产决策”的黄金窗口期。
然而,从卓越的实验室原型走向高可靠、低成本的规模化产品,横亘着芯片协同设计、封装良率、极端热管理及生态协同等多重挑战。这些跨越技术与商业的沟壑,需要全产业链凝聚智慧,共同突破。
在此背景下,由谈思科技主办,CPO Asia 2026 亚洲光电共封装技术创新大会将于2026年7月23-24日在上海隆重举行。本届大会将摒弃泛谈,直击产业化核心痛点,定位为“量产决策窗口期的关键产业会议”。我们旨在汇聚全球芯片设计、先进封装、材料设备、测试验证及终端应用的决策者与攻坚者,不仅勾勒技术蓝图,更深入拆解量产难题,探索协同方案,共同绘制CPO从“前沿突破”到“规模商用”的可行路线图。
四大深度技术分论坛,垂直攻坚产业化全链路
Four In-Depth Technical Forums, Tackling the Full Industrialization Chain Vertically
汇聚产业核心决策层,打造高浓度交流平台
Gathering Core Industry Decision-Makers to Build a High-Engagement Exchange Platform
精准对接会
Precision Matchmaking Sessions
供应商与客户、技术与资本间的“一对一精准对接”,推动实质合作。
Facilitating one-on-one, targeted meetings between suppliers and clients, as well as between technology and capital, to drive tangible collaboration
专题研讨会
Specialized Workshops
针对 “CPO的标准化测试接口”等技术痛点,举办小范围、邀请制的深度研讨会
Specialized deep-dive workshops will be conducted on critical technical pain points, such as "standardized testing interfaces for CPO". These sessions are designed to be small-scale and invitation-only
演讲嘉宾
Call for Speakers
大会议程
July 2026
07/23
2026.07.23
Day 1
2026.07.24
Day 2
Apply for Detailed Agenda
09:00-12:00
硅光芯片与协同设计
Sub-Forum A: Silicon Photonics and Co-Design
09:00-12:00
硅光芯片与协同设计
Sub-Forum A: Silicon Photonics and Co-Design
09:00-12:00
深入芯片级性能突破、异构集成架构与协同设计方法学
Delving into chip performance and co-design methodologies
09:00-12:00
深入芯片级性能突破、异构集成架构与协同设计方法学
Delving into chip performance and co-design methodologies
14:00-17:00
封装工艺与良率突破
Sub-Forum B: Packaging Process and Yield Breakthrough
14:00-17:00
封装工艺与良率突破
Sub-Forum B: Packaging Process and Yield Breakthrough
14:00-17:00
聚焦混合键合、先进材料与良率提升等量产核心工艺
Focusing on core production processes and yield enhancemen
14:00-17:00
聚焦混合键合、先进材料与良率提升等量产核心工艺
Focusing on core production processes and yield enhancemen
14:00-17:00
CPO标准化测试接口专题研讨会
“CPO Standardized Test Interface” Special Workshop
14:00-17:00
CPO标准化测试接口专题研讨会
“CPO Standardized Test Interface” Special Workshop
14:00-17:00
推动接口标准化、破解量产测试经济性瓶颈
Aims to advance interface standardization, address the economic bottlenecks in volume testing
14:00-17:00
推动接口标准化、破解量产测试经济性瓶颈
Aims to advance interface standardization, address the economic bottlenecks in volume testing
14:00-17:00
CPO vs. LPO: AI时代的互连抉择与融合前瞻
Opening Thought Salon: CPO vs. LPO: Interconnect Choices and Convergence Outlook in the AI Era
14:00-17:00
CPO vs. LPO: AI时代的互连抉择与融合前瞻
Opening Thought Salon: CPO vs. LPO: Interconnect Choices and Convergence Outlook in the AI Era
部分合作媒体
热门话题
硅光CPO规模商用路径与数据中心部署展望
CPO系统级协同优化与商业可行性分析
CPO封装良率提升路径与量产成本博弈
未来数据中心如何重新定义CPO的商业竞争力
CPO供应链协同与成本分析以实现规模化商业落地
应对千瓦级功耗的CPO系统级热管理架构如何更好演进
构建CPO从芯片到机房的端到端热与能源管理智能闭环
破解产业化死循环:测试、成本与生态
重构互联:以光I/O Chiplet为核心的CPO异构集成新范式
混合键合技术驱动CPO封装密度与可靠性飞跃
突破二维平面限制的CPO三维集成与散热技术前瞻
针对AI算力集群的CPO系统集成架构与部署挑战
CPO互联标准化进程与互操作性测试生态构建
面向光电合封的微通道与相变冷却技术创新前沿
如何破解CPO封装需求与产能规划难题?
高端材料与基板供应链对接
参会评价

I had the pleasure of presenting a keynote at AutoSec Europe 2025 in Frankfurt, diving deep into the challenges of ensuring cybersecurity for decades. Thanks to everyone who joined the conversation!

Chief Product Security Officer

This was a very good event overall, and I believe it has the potential to grow. We are very happy with the organizers and hope that we will have a nice long term collaboration. Thanks again for everything.

Founder

Well established in the Asia-Pacific region for many years, Especially at a time when market dynamics and geopolitical developments can create noticeable tensions, it is clear how important collaboration and cooperation are as catalysts for cybersecurity in organisations and for joint value creation between OEMs, suppliers and technical experts in the market.

Managing Director

Delighted to share my insights on AI security at the 1st Europe AutoSec in Frankfurt last week. I highlighted the growing importance of securing AI components in the automotive sector, especially in light of emerging regulations, standards, and guidelines. To fully realize AI's benefits, we must prioritize security and safety.

Researcher Product Cybersecurity & Privacy

Really really good overall, keep it up!

System Desgin Engineer

Overall the summit was nice! Good things to take away!

Software Engineer

First time that I am attended on this event - was great.

Specialist Information Security

Great opportunities to get to know each other and exchange ideas regarding automotive cybersecurity. And many thanks to the TaasLabs team.

Chief Product Manager
Participant List
往期精彩回顾
Past Highlights
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